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Dear Friends, We had extremely great feedback for our traditional WBG Conference we held together with AspenCore in Munich last December at the airport Hilton. This success story will continue. We have started planning for the 4th event in this series in December 2020. The 2019 presentations are available on the web power-conference.com/schedule.
The next highlight for WBG device progress will be at PCIM. Again, I will have the podiums discussion on Wednesday the 6th of May in Nuremberg. Stay tuned for the upcoming details!

Do not miss our Chinese version bodospowerchina.com. There is no better way to communicate. As a publisher I serve the world: one magazine, on time, every time. Best Regards, Bodo Arlt
Please add our address newsletter@bodospower.de to your approved sender list to ensure inbox delivery. View online version
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Dear Friends,

We had extremely great feedback for our traditional WBG Conference we held together with AspenCore in Munich last December at the airport Hilton. This success story will continue. We have started planning for the 4th event in this series in December 2020. The 2019 presentations are available on the web power-conference.com/schedule.
The next highlight for WBG device progress will be at PCIM. Again, I will have the podiums discussion on Wednesday the 6th of May in Nuremberg. Stay tuned for the upcoming details!

Do not miss our Chinese version bodospowerchina.com. There is no better way to communicate. As a publisher I serve the world: one magazine, on time, every time.

Best Regards,

Bodo Arlt editor@bodospower.com

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e-Newsletter Content - just click and get to your topic:
The News
- New Ownership Opens Up Opportunities
- Expansion of Network in North America
- Joining Partner Program to Reduce Customer Time-to-Market
- Pre-APEC Power Electronics Capacitor Workshop
- Readout System for Large Arrays of Quantum Dots
- IC Design Center on All About Circuits
- ECPE Events
Preview of Content in the February Issue
- Viewpoint
- Product of the Month
- Cover Story
- Power Modules
- Wide Band Gap
- Power Modules
Events
New Products
- Smart Driver IC for Battery Powered DC Motors
- 3W ACDC Converter with Transient Output Power
- 300 W Adapter Reference Design Highlights GaN Innovation
- Hybrid Surge Protective Device
- 1200 V Single-Die E-Mode GaN Power Devices
- Fully Integrated Power-Management IC
- Power Supplies Suitable for Medical Applications
- Cooling Solutions
- Rack-Mount Programmable DC Load
- Powder Alloy Material

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The News

New Ownership Opens Up Opportunities
Nexperia announced that Wingtech Technology – a Chinese computer and telecom equipment manufacturer – has officially obtained a controlling stake in Nexperia from Beijing Jianguang Asset Management Co. Ltd (JAC Capital). Headquartered in Nijmegen, Netherlands, Nexperia will stay an independent company, operating under Dutch law, and with the same management team, led by CEO Frans Scheper.
View full press release
nexperia.com/press-releases

Expansion of Network in North America
Asahi Kasei America has opened an office in Novi, Michigan, to strengthen its marketing function in North America, mainly in the automotive field. In the Asahi Kasei Group's medium-term management initiative "Cs+ for Tomorrow 2021," mobility is identified as a priority field for provision of value in the Material business sector.
View full press release
asahi-kasei.co.jp/news

Joining Partner Program to Reduce Customer Time-to-Market
Innolectric announces that it has joined the STMicroelectronics Partner Program to leverage ST's innovative technology to make its products even more efficient and robust while increasing those products' visibility to ST's customers. In addition, within the ST Partner Program, both partners are collaborating on developing efficient power electronics with a view to the future.
View full press release
innolectric.ag

Pre-APEC Power Electronics Capacitor Workshop
The Power Sources Manufacturers Association (PSMA) and the IEEE Power Electronics Society (IEEE PELS) are jointly sponsoring its third annual Capacitors in Power Electronics Workshop. This year's all-day workshop entitled, "How to Choose and Define Capacitor Usage for Emerging Applications," will be held on Saturday, March 14, 2020, the day before the start of and in the same venue as APEC 2020 at the Ernest N. Morial Convention Center in New Orleans, LA.
psma.com/technical-forums

Readout System for Large Arrays of Quantum Dots
Leti and its research partners have demonstrated a potentially scalable readout technique that could be fast enough for high-fidelity measurements in large arrays of quantum dots. The international research team reported its work on developing a toolkit on a SOI MOSFET-based prototyping platform that enables fast reading of the states of charge and spin.
View full press release
leti-cea.com/Press

IC Design Center on All About Circuits
EETech is pleased to unveil the newest addition to All About Circuits (AAC), the IC Design Center for IP Cores. This IC Design Center comes on the heels of AAC's recent redesign and will provide new, in-depth resources for IC Design experts and novices alike. Recognizing that IC design information is often challenging without widely available technical resources, EETech looked to the experts to bring this industry-leading IC Design Center to life. 
eetech.com/press

ECPE Events
• ECPE Workshop 'Power Semiconductor Robustness - What Kills Power Devices?'
13 January (afternoon) - 14 January 2020, Munich, Germany

• ECPE Tutorial 'Drivers and Control Circuitry for IGBTs and MOSFETs'
18 - 19 February 2020, Barcelona, Spain

• ECPE Workshop 'Magnetic Components in Power Electronics'
19 - 20 February 2020, Grenoble, France

• ECPE Tutorial 'EMC in Power Electronics'
22 - 23 June 2020, Eindhoven, Netherlands
ecpe.org/events

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Preview of Content in the February Issue

Viewpoint
We Are Digital Too

Product of the Month
Powder Cores Designed for Cutting Edge Performance

Cover Story
SiC Based Totem Pole PFC for Industrial Power Supplies

For industrial power supplies, energy efficiency is a key product feature since any energy, which is not delivered to the load but is converted to waste heat, is a direct cost factor in system operation. In addition, any waste heat from inefficient energy conversion results in additional demands on the air conditioning system.
Christian Felgemacher and Aly Mashaly, ROHM Semiconductor GmbH

Power Modules
Smart Solution for the Next Generation of Power Electronics Systems

The fleXible High power Platform XHP has been developed for applications like traction converters, renewable energy, and industrial drives]. It addresses the needs for scalable and low inductive inverter designs. The existing XHP 3 has been designed for blocking voltages from 3.3 kV up to 6.5 kV addressing new designs in traction applications. It can handle blocking voltages up to 3.3 kV.
By Karsten Schoo and Wilhelm Rusche, Infineon Technologies

Wide Band Gap
Scalability of SiC Near Chip-Scale Packages to Electric Vehicle & Locomotive Traction

I shared with you previously that power WBG/SiC devices traditionally packaged in bulky DBC modules can be replaced with Near Chip-Scale SMD packages. The replacement is enabled by the WBG device's smaller die size (higher power density) and its higher efficiency. Near Chip-Scale packages like the µMaxPak can reduce package sizes & parasitics, enabling SiC devices to operate at their full performance, efficiency & speed.
By Courtney Furnival, Semiconductor Packaging Solutions, Lake Arrowhead, California

Power Modules
Versatile IGBT Power Module for Demanding Industrial and Automotive Applications

The SKiM63/93 power semiconductor module was launched in 2011 and, owing to its versatility, has become an important IGBT module platform for many applications. Initially the SKiM63/93 module platform used silicon IGBT and diode chips, employing sintering die attach to deliver excellent power cycling capability.
By Marco Honsberg and Anastasia Schiller, SEMIKRON INTERNATIONAL GmbH

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Events

NEPCON, Tokyo, Japan, January 15-17 nepconjapan.jp

DesignCon, Santa Clara, CA, USA, January 28-30 designcon.com

APEX, San Diego, CA, USA, February 1-6 ipcapexexpo.org

India Electronics Week, Bangalore, India, February 13-15 indiaelectronicsweek.com

Embedded World, Nuremberg, Germany, February 25-27 embedded-world.de

Battery Electric Vehicle Architectures, Detroit, MI, USA, February 26-27 beva-detroit.com

Power Analysis & Design Symposium, Eching, Germany, March 5 omicron-lab.com/training-events

Satellite, Washington, DC, USA, March 9-12 satshow.com

APEC, New Orleans, LA, USA, March 15-19 apec-conf.org

EMV, Cologne, Germany, March 17-19 mesago.de/en/EMV

AMPER, Brno, CZ, March 17-20 amper.cz

SEMICON China, Shanghai, China, March 18-20 semiconchina.org

electronica China, Shanghai, China, March 18-20 electronica-china.com

productronica China, Shanghai, China, March 18-20 productronica-china.com

CWIEME Shanghai, Shanghai, China, March 24-26 cn.coilwindingexpo.com

CIPS, Berlin, Germany, March 24-26 cips.eu

Battery Tech Expo, Silverstone, UK, March 26 batterytechexpo.co.uk

Power Electronics Expo, Silverstone, UK, March 26 powerelectronicsexpo.co.uk

ExpoElectronica, Moscow, Russia, April 14-16 expoelectronica.ru

Hannover Messe, Hannover, Germany, April 20-24 hannovermesse.de

PEMD, Nottingham, UK, April 21-23 theiet.org/pemd

EV Tech Expo Europe, Stuttgart, Germany, April 28-30 evtechexpo.eu

The Battery Show Europe, Stuttgart, Germany, April 28-30 thebatteryshow.eu

PCIM Europe, Nuremberg, Germany, May 5-7 mesago.de/en/PCIM

SMTconnect, Nuremberg, Germany, May 5-7 mesago.de/en/SMT

SCAPE, Stockholm, Sweden, May 10-12 ri.se/en/scape-2020

SEMICON Southeast Asia, Kuala Lumpur, Malaysia, May 12-14 semiconsea.org

ISPSD Conference, Vienna, Austria, May 17-21 ispsd2020.com

CWIEME Berlin, Berlin, Germany, May 26-28 coilwindingexpo.com/berlin

Workshop on Supercapacitors, Viterbo, Italy, May 27-28 supercap.org

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New Products

Smart Driver IC for Battery Powered DC Motors
TRINAMIC Motion Control announces the TMC7300, a low-voltage driver for one DC motor up to 2A peak, or two DC motors up to 2.4A peak. Operating on a single or dual Li-Ion cell or at least 2 AA batteries, the TMC7300 is optimal for battery-operated equipment such as IoT and handheld devices, printers and POS applications, toys, cameras, and mobile medical devices.
View full press release
trinamic.com/news

3W ACDC Converter with Transient Output Power
For solving industrial difficulties, by comprehensively optimizing circuit design, material platform and other R&D platforms, MORNSUN researched and firstly launched 3W high transient power AC/DC converter LDE03-20Bxx-O series, assisting the demand of high transient power system, which the 3W power supply reliably replaces the 12W steady output power supply, and optimizing system dimension and cost.
View full press release
mornsun-power.com/about

300 W Adapter Reference Design Highlights GaN Innovation
GaN Systems and ON Semiconductor announced the availability of the world's highest power density 300 watt AC Adapter Reference Design using GaN Systems' 650 V, 15 A GaN E-HEMTs and multiple award-winning ON Semiconductor Controller and Driver ICs: NCP51820, NCP13992, NCP1616, and NCP4306. This complete system reference design is highly versatile and low cost, allowing designers to easily develop and bring to market ultra-high power density adapters for various applications in HDTV power supplies, gaming notebook and console adapters as well as ultra-small power supplies for industrial and medical devices.
View full press release
gansystems.com/newsroom

Hybrid Surge Protective Device
Bourns, Inc. announced the Bourns Model 1202 Series. This Type 1 hardwired hybrid surge protective device (SPD) is designed for AC infrastructure applications. Bourns engineers have combined the company's fast-responding Metal Oxide Varistor (MOV) technology with its low leakage Gas Discharge Tube (GDT) technology to deliver a device that provides consistent, long-life, reliable and enhanced protection performance.
View full press release
bourns.com/press-releases

1200 V Single-Die E-Mode GaN Power Devices
GaN Power International has achieved an important milestone in the development of high-voltage GaN power devices. After introducing its first lateral EMODE GaN power transistor (GPIHV15DK), a 1200V/15A device in a TO252 package, this past summer, the company more recently released a second GaN FET (GPIHV30DDP5L) at 1200V/30A in a TO263-5. This latest development indicates that GaN Power's success in producing a 1200V GaNFET was no accident and that 1200V GaN can be scaled to higher current/power.
View full press release
iganpower.com

Fully Integrated Power-Management IC
With features including four DC/DC buck converters, a boost DC/DC converter, and six low-dropout regulators (LDOs), the STMicroelectronics STPMIC1 power-management IC (PMIC) satisfies the complex power demands of highly integrated application-processor based systems. The chip is optimized as a companion PMIC for ST's STM32MP1 heterogeneous multicore microprocessors, which target a broad range of applications by integrating single or dual Arm Cortex-A7 and Cortex-M4 cores, an optional 3D graphics processing unit, and rich digital and analog peripherals.
View full press release
st.com/media-center

Power Supplies Suitable for Medical Applications
Components Bureau extends its range of Medical power supplies from Cosel, the PCA Series AC-DC Power Supplies are available. The PCA series comprises of 3 models offering power range from 300W - 1000W and meets 2MOPP, EN60601-1 certification. It comes packaged in 89mm x 41mm x 152mm (without terminal block and screw). Average efficiency up to 93% with an operating temperature of -20°C ~ 70°C.
View full press release
componentsbureau.com

Cooling Solutions
The Power Electronics Solutions (PES) Group of the Rogers Corporation is presenting two product expansions from the curamik cooler product family. The two water-cooled laser diode coolers efficiently derive the heat from powerful laser diodes on the smallest surfaces, improve performance efficiency and extend the lifespan. curamik CoolPerformance Plus coolers are manufactured for outstanding cooling performance from OFHC copper and a highly conductive ceramic substrate, which, in combination, produces a precisely controllable coefficient of thermal expansion (CTE).
rogerscorp.com

Rack-Mount Programmable DC Load
Elektro-Automatik announces the EA-ELR 10000 30 KW Programmable Electronic Load. The 4U rack-mounted ELR 10000 4U, engineered with advanced SiC power conversion devices, boasts the industry's best power density-requiring as little as half the rack space for the same power output as competing programmable loads. This latest generation ELR combines its high-efficiency programmable DC load with an equally efficient inverter (regenerative) output stage, returning up to 95% of the energy used in the test back to the ac grid.
View full press release
elektroautomatik.us/latest-news

Powder Alloy Material
For designers targeting superior efficiency and who need inductors with the lowest losses at high frequency, Magnetics has developed a breakthrough powder alloy material: Kool Mµ Hƒ. Kool Mµ Hƒ is a sendust powder alloy similar to Kool Mµ, Magnetics' economical power inductor material, and Kool Mµ MAX, which offers superior DC bias under current loading. With the availability of Kool Mµ Hƒ, engineers have a third option when considering a Kool Mµ core inductor, an option which optimizes for best AC core loss at any frequency.
View full press release
mag-inc.com/News

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Content provider in terms of the german Telemediengesetz (TMG): Bodo's Power Systems
Responsible according to § 6 TMG: Bodo Arlt - editor@bodospower.com
Address: Katzbek 17a - D-24235 Laboe Germany
Phone: +49 4343 421790
Fax: +49 4343 421789

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